- Development, production and marketing of optoelectronic, optomechanical, microelectronic and micromechanical assemblies and systems.
Service provider with the following technology focuses: - Micro-optics (conventional and UV replication) - MEMS/MOEMS - Wafer saws with extreme cleanliness requirements - Mounting and connection technology for image sensors (COB) - Mounting and connection technology for sensor modules in medical technology – Micro-assembly (active and passive alignment technology) - Measurement technology for contract measurements in the nm range
- Manufacturer of micro-optics from glass/plastic, micromechanics, microstructure masters
- Micro-optics (conventional and UV replication) - MEMS/MOEMS - Wafer saws with extreme cleanliness requirements - Mounting and interconnection technology for image sensors (COB) - Mounting and interconnection technology for sensor modules in medical technology - Micro-assembly cells with high reproducibility - Active and passive alignment technology in micro-assembly cells - Measurement technology for contract measurements in the nm range
- At the moment, the company exclusively operates as service provider, the optic modules are installed in end devices by the customer and introduced into the market. Services: .support of the supplier chain . Project management . Design for manufacturing, design to cost (focus on Micro) . Optic design . Product design opto-packaging (focus on image sensors/camera technology) . Prototyping & contract measurements . Wafer saws with extreme requirements regarding cleanness . Chip and wire bonding . Passivation . Laser labelling
ISO 9001:2015
